The effects of vacuum ultraviolet radiation on low - k dielectric films

نویسندگان

  • M. T. Nichols
  • J. L. Lauer
  • M. Tomoyasu
  • N. M. Russell
  • G. Jiang
  • G. A. Antonelli
  • N. C. Fuller
  • H. Sinha
  • H. Ren
  • S. U. Engelmann
  • Q. Lin
  • V. Ryan
  • Y. Nishi
  • J. L. Shohet
چکیده

Correlated evolution of barrier capacitance charging, generation, and drift currents and of carrier lifetime in Si structures during 25 MeV neutrons irradiation Appl. The relaxation behaviour of supersaturated iron in single-crystal silicon at 500 to 750°C Comment on " Lifetime recovery in ultra-highly titanium-doped silicon for the implementation of an intermediate band material " [Appl. Deep level transient spectroscopy and minority carrier lifetime study on Ga-doped continuous Czochralski silicon Appl. Plasmas, known to emit high levels of vacuum ultraviolet (VUV) radiation, are used in the semiconductor industry for processing of low-k organosilicate glass (SiCOH) dielectric device structures. VUV irradiation induces photoconduction, photoemission, and photoinjection. These effects generate trapped charges within the dielectric film, which can degrade electrical properties of the dielectric. The amount of charge accumulation in low-k dielectrics depends on factors that affect photoconduction, photoemission, and photoinjection. Changes in the photo and intrinsic conductivities of SiCOH are also ascribed to the changes in the numbers of charged traps generated during VUV irradiation. The dielectric-substrate interface controls charge trapping by affecting photoinjection of charged carriers into the dielectric from the substrate. The number of trapped charges increases with increasing porosity of SiCOH because of charge trapping sites in the nanopores. Modifications to these three parameters, i.e., (1) VUV induced charge generation, (2) dielectric-substrate interface, and (3) porosity of dielectrics, can be used to reduce trapped-charge accumulation during processing of low-j SiCOH dielectrics. Photons from the plasma are responsible for trapped-charge accumulation within the dielectric, while ions stick primarily to the surface of the dielectrics. In addition, as the dielectric constant was decreased by adding porosity, the defect concentrations increased. V C 2012 American Institute of Physics.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Effects of ultraviolet (UV) irradiation in air and under vacuum on low-k dielectrics

This work addresses the issue as to whether ultraviolet radiation of wavelengths longer than 200 nm can break Si-CH3 bonds in porous low-k dielectrics. To resolve this issue, porous SiCOH films (k = 2.3) were exposed to 4.9 eV (254 nm) ultraviolet (UV) radiation in both air and vacuum for 1 hour. Using Fourier Transform Infrared (FTIR) spectroscopy, the chemical structures of the dielectric fil...

متن کامل

Effect of vacuum-ultraviolet irradiation on the dielectric constant of low-k organosilicate dielectrics

Articles you may be interested in Effects of plasma and vacuum-ultraviolet exposure on the mechanical properties of low-k porous organosilicate glass J. Bandgap measurements of low-k porous organosilicate dielectrics using vacuum ultraviolet irradiation Appl. Characteristics of ultra low-k nanoporous and fluorinated silica based films prepared by plasma enhanced chemical vapor deposition Plasma...

متن کامل

Surface photoconductivity of organosilicate glass dielectrics induced by vacuum-ultraviolet radiation

The temporary increase in the electrical surface conductivity of low-k organosilicate glass (SiCOH) during exposure to vacuum-ultraviolet radiation (VUV) is investigated. To measure the photoconductivity, patterned " comb structures " are deposited on dielectric films and exposed to synchrotron radiation in the range of 8–25 eV, which is in the energy range of most plasma vacuum-ultraviolet rad...

متن کامل

Plasma damage effects on low-k porous organosilicate glass

Damage induced in low-k porous organosilicate glass SiCOH dielectric films by exposure to an electron cyclotron resonance ECR plasma was investigated. The effects of charged-particle bombardment and vacuum ultraviolet radiation were separated. Flux measurements showed that the ECR plasma has a greater photon flux in the vacuum ultraviolet VUV range than in the UV range. Damage was measured by e...

متن کامل

Effects of vacuum-ultraviolet irradiation on copper penetration into low-k dielectrics under bias-temperature stress

Articles you may be interested in Effect of vacuum-ultraviolet irradiation on the dielectric constant of low-k organosilicate dielectrics Appl. Effects of plasma and vacuum-ultraviolet exposure on the mechanical properties of low-k porous organosilicate glass J. Bandgap measurements of low-k porous organosilicate dielectrics using vacuum ultraviolet irradiation Appl. The effects of plasma expos...

متن کامل

Effects of vacuum ultraviolet irradiation on trapped charges and leakage currents of low-k organosilicate dielectrics

Articles you may be interested in Effect of vacuum-ultraviolet irradiation on the dielectric constant of low-k organosilicate dielectrics Appl. Bandgap measurements of low-k porous organosilicate dielectrics using vacuum ultraviolet irradiation Appl. The effects of plasma exposure and vacuum ultraviolet irradiation on photopatternable low-k dielectric materials Effect of vacuum ultraviolet and ...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2012